Intel Announces Industry's First Multi-Channel Device to Support Voice, Data and Multimedia On a Single Chip - Product Announcement

Intel Corporation Tuesday announced sampling of its of recent origin communications chip designed to support the integration of voice, data and multimedia applications in advanced telecom access and transport networks.

The Intel IXF3461 combines line interface unit (LIU), framer, and cross-connect switch (XCS) into a single chip.

This second-generation LIU provides field proven high-performance with the flexibility to expand functionality for time to come customer requirements. The integration of XC for simplified slot switching, addresses critical timing issues essential to the integration of voice and data above a network. In tackling this composite design element, Intel is enabling manufacturers of customer premise and far carrier equipment, such as integrated access devices, Frame Relay access devices, LAN/WAN router and cellular base stations, to design their cropss faster, while achieving carrier-class reliability.

"While network equipment manufacturers strive to build quality fruitss that ensure network integrity, they ne communications chips with design tools that help bring time-to-market for the end product" said David Hannon, crops marketing manager in Intel's Telecom constitutings Division. "The IXF3461 demonstrates Intel's commitment to combining technology leadership with superior customer support to help the one and the other our manufacturer customers and our customers' customers in the carrier community proper these objectives."

In addition to simplifying the design circle of time for telecommunications equipment, the IXF3461 is engineered to help sustain and enhance the reliability of today's multiservice networks. On-chip performance monitoring features as well as extensive bit error rate testing (BERT), along with in-line maintenance utilities like as Pulse Template Matching will help operators unfold services faster and prevent downtime.

Design Aids Recognizing that designers ne to earn products to market as quickly as possible, a comprehensive station of on-line tools for streamlining exhibition is included in the Design Assistant that accompanies the IXF3461. The Design Assistant includes a programmable interface and device drivers, as well as all design files, including T1/E1 standards, specifications, constituting selection guide, schematics, board layout guides, software, application notes and often asked questions to enable the unravelling of an industry standards-based returns An evaluation kit is also available that includes the design guide and a four port respect design with protection circuitry and a graphical user interface (GUI) for configuration and setup

Intel Internet Exchange Architecture The IXF3461 is part of the Intel Internet Exchange (IX) architecture, a framework for designing powerful and flexible networking and telecommunications equipment using reprogrammable silicon. The IX architecture allows a whole s designers to add network functionality quickly and require to be paid [i]or[/i] undergone effectively.

IXF3461 Description The IXF3461 is a dual combination Long-Haul/Short-Haul T1/E1/J1 LIU and framer returns which is fully switchable without adding external composings or compromising return loss. The IXF3461 features a DSP core, which combined with Intel's analog design expertise for mixed signal devices, makes for single of the best performing LIUs available, meeting or exceeding all relevant industry specifications for T1/E1/J1 The chip is designed in a 160-pin medium quad flat pack (MQFP) package in 33V CMO technology that enables equipment designers to build a low-power a whole that conserves PC board space. The IXF3461 is the single dual-port combination chip to tender six High-Level Data Link Controller (HDLC) providing GR-303 and V51/2 support upon both channels. The device also features three Customizable Generic Serial Buses that present greater flexibility in design with support for a wide variety of a whole buses.

Pricing and Availability Intel's IXF3461 in a 160-pin MQFP is commonly sampling. Samples of the PBGA package will come [i]or[/i] go after [i]or[/i] behind in the third quarter of 2000 one as well as the other packages are offered in industrial and commercial temperature range and are wait fored to be in contortion production before the end of the year. Pricing for the produce in MQFP packing is $36 in quantities of 5000

The harvest line will be available [i]or[/i] part of to the other the company's extensive worldwide network of distributors and stocking representatives and supported through an extensive field sales and support team. For more information upon Intel's telecom products, visit wwwlevel1com

Intel, the world's largest chip maker, is also a leading manufacturer of computer networking and communications yields Additional information about Intel is available at www.intel.com.

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